AG606
The Communications Edge
TM
Product Information
Push-Pull CATV Amplifier
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
qC
reflow temperature) and lead (maximum 245
qC
reflow temperature) soldering processes.
AG606-G (Lead-Free Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“AG606G” designator with an alphanumeric
lot code on the top surface of the package.
The obsolete tin-lead package is marked with
an “AG606” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value
Test:
Standard:
Class 1C
1000 to 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
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MSL Rating: Level 2 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
Land Pattern
1.
2.
3.
4.
5.
6.
7.
8.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135” )
diameter drill and have a final plated through diameter of
.25mm (.010” )
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal
performance. Otherwise ground vias should be placed as
close to the land pattern as possible.
All dimensions are in mm. Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
9.
MTTF vs. GND Tab Temperature
10000
MTTF (Million Hrs)
Rating
-40 to +85
qC
63
qC/W
142
qC
1000
100
10
1
50
60
70
80
90
100
Tab Temperature (°C)
Notes:
1. The thermal resistance is referenced from the hottest part
of the junction to ground tab underneath the device.
2. This corresponds to the typical biasing condition of
+5.16V, 175 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
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Specifications and information are subject to change without notice.
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WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 5
April 2006
WJCI [ WJ COMMUNICATION. INC. ]
