AG503-89
InGaP HBT Gain Block
Product Information
AG503-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG503-89G will be marked with an
“A503G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Test:
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Standard:
Land Pattern
ESD Rating: Class IV
Value:
Test:
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Standard:
MSL Rating: Level 3 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
MTTF vs. GND Tab Temperature
Thermal Specifications
1000
100
10
Parameter
Rating
-40 to +85°C
232° C/W
137° C
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
1
+5V, 45 mA at an 85°C case temperature.
A
60
70
80
90
100
110
120
minimum MTTF of 1 million hours is achieved for
Tab Temperature (°C)
junction temperatures below 177 °C.
Specifications and information are subject to change without notice
Page 5 of 6 June 2005
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