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AG403-89PCB 参数 Datasheet PDF下载

AG403-89PCB图片预览
型号: AG403-89PCB
PDF下载: 下载PDF文件 查看货源
内容描述: 的InGaP HBT增益模块 [InGaP HBT Gain Block]
分类和应用:
文件页数/大小: 6 页 / 511 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
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AG403-89
InGaP HBT Gain Block
Product Information
AG403-89 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The AG403-89 will be marked with
“AG403” designator. An alphanumeric
code (“XXXX-X”) is also marked below
part designator on the top surface of
package.
an
lot
the
the
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
-40 to +85°C
191° C/W
141° C
MTTF (million hrs)
Rating
1000
MTTF vs. GND Tab Temperature
100
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+4.91V, 60 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
°C.
10
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 6
June 2005