AG302-63
InGaP HBT Gain Block
Product Information
AG302-63G (Green / Lead-free SOT-363 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
Product Marking
The component will be marked with an “I”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Test:
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Standard:
ESD Rating: Class IV
Value:
Test:
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Standard:
MSL Rating: Level 3
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Lead Temperature
Thermal Specifications
10000
1000
100
10
Parameter
Rating
-40 to +85°C
325° C/W
133° C
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
1. The thermal resistance is referenced from the hottest part
of the junction to the ground pin (pin 4).
1
60
70
80
90
100
110
120
2. This corresponds to the typical biasing condition of
Ground Lead Temperature (°C)
+4.23V, 35 mA at an 85°C case temperature.
A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 °C.
Specifications and information are subject to change without notice
Page 6 of 6 July 2005
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