I5216EY 参数 Datasheet PDF下载

ISD5216

12. PACKAGE SPECIFICATIONG ............................................................................................... 70

12.1. PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE E DIMENSIONS.............. 70

12.2. Plastic Small Outline Integrated Circuit (SOIC) DIMENSIONS ....................................... 71

12.3. Plastic Dual Inline Package (PDIP) Dimensions.............................................................. 72

13. ORDERING INFORMATION................................................................................................... 73

14. VERSION HISTORY ............................................................................................................... 74

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