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I5102EYI 参数 Datasheet PDF下载

I5102EYI图片预览
型号: I5102EYI
PDF下载: 下载PDF文件 查看货源
内容描述: [Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28]
分类和应用: 存储音频合成器集成电路消费电路商用集成电路光电二极管蜂窝移动电话便携式设备
文件页数/大小: 88 页 / 604 K
品牌: WINBOND [ WINBOND ]
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ISD5100 – SERIES  
12.4 ISD5116 DIE INFORMATION  
VCCD  
VCCD  
VSSD  
SDA  
A0  
SCL  
A1  
INT  
RAC  
VSSA  
VSSD  
XCLK  
ISD5116 Device  
Die Dimensions  
X: 4125 µm  
Y: 8030 µm  
Die Thickness [3]  
292.1 µm ± 12.7 µm  
Pad Opening  
ISD5116  
Single pad: 90 x 90 µm  
Double pad: 180 x 90 µm  
VSSA  
MIC +  
AUX OUT  
AUX IN  
[2]  
MIC -  
ANA OUT -  
SP -  
VSSA  
VCCA  
SP +  
ANA IN  
[2]  
ANA OUT +  
ACAP  
Notes  
1.  
The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or  
damage may occur.  
2.  
3.  
Double bond recommended, if treated as single doubled-pad.  
This figure reflects the current die thickness. Please contact Winbond as this thickness may change in  
the future.  
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