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I5102EYI 参数 Datasheet PDF下载

I5102EYI图片预览
型号: I5102EYI
PDF下载: 下载PDF文件 查看货源
内容描述: [Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28]
分类和应用: 存储音频合成器集成电路消费电路商用集成电路光电二极管蜂窝移动电话便携式设备
文件页数/大小: 88 页 / 604 K
品牌: WINBOND [ WINBOND ]
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ISD5100 – SERIES  
2. FEATURES  
Fully-Integrated Solution  
Single-chip voice record/playback solution  
Dual storage of digital and analog data  
Durations  
8 to 16-minute (ISD5116)  
4 to 8-minute (ISD5108)  
2 to 4-minute (ISD5104)  
1 to 2-minute (ISD5102)  
Low Power Consumption  
+2.7 to +3.3V (VCC) Supply Voltage  
Supports 2.0V and 3.0V interface logic  
Operating Current:  
ICC Play = 15 mA (typical)  
ICC Rec = 30 mA (typical)  
ICC Feedthrough = 12 mA (typical)  
Standby Current:  
ISB = 1µA (typical)  
Most stages can be individually powered down to minimize power consumption  
Enhanced Voice Features  
One or two-way conversation record  
One or two-way message playback  
Voice memo record and playback  
Private call screening  
In-terminal answering machine  
Personalized outgoing message  
Private call announce while on call  
Digital Memory Features  
Up to 4 Mb available (ISD5116)  
Up to 2 Mb available (ISD5108)  
Up to 1 Mb available (ISD5104)  
Up to 512Kb available (ISD5102)  
Storage of phone numbers, system configuration parameters and message address table in cellular  
application  
Easy-to-use and Control  
No compression algorithm development required  
User-controllable sampling rates  
Programmable analog interface  
Standard & Fast mode I2C serial interface (100kHz – 400 kHz)  
Fully addressable for multiple messages  
High Quality Solution  
High quality voice and music reproduction  
Winbond’s standard 100-year message retention (typical)  
100K record cycles (typical) for analog data  
10K record cycles (typical) for digital data  
Options  
Available in die form, TSOP and SOIC and PDIP (ISD5116 Only)  
Temperature: Commercial – Packaged (0 to +70°C) & die (0 to +50°C); Industrial (-40 to +85°C)  
Publication Release Date: October, 2003  
Revision 0.2  
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