ISD4002 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 3
3. BLOCK DIAGRAM .............................................................................................................................. 4
4. TABLE OF CONTENTS ...................................................................................................................... 5
5. PIN CONFIGURATION ....................................................................................................................... 6
6. PIN DESCRIPTION............................................................................................................................. 7
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12
7.1. Detailed Description.................................................................................................................... 12
7.2. Serial Peripheral Interface (SPI) Description.............................................................................. 13
7.2.1. OPCODES ........................................................................................................................... 14
7.2.2. SPI Diagrams....................................................................................................................... 15
7.2.3. SPI Control and Output Registers........................................................................................ 16
8. TIMING DIAGRAMS.......................................................................................................................... 18
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20
9.1. Operating Conditions.................................................................................................................. 21
10. ELECTRICAL CHARACTERISTICS............................................................................................... 22
10.1. Parameters For Packaged Parts .............................................................................................. 22
10.2. Parameters For Die .................................................................................................................. 25
10.3. SPI AC Parameters .................................................................................................................. 26
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 27
12. PACKAGING AND DIE INFORMATION......................................................................................... 30
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 31
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ...................... 32
12.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 33
12.5. Die Information ......................................................................................................................... 34
13. ORDERING INFORMATION........................................................................................................... 36
14. VERSION HISTORY ....................................................................................................................... 37
Publication Release Date: October 26, 2005
- 5 -
Revision 1.3
WINBOND [ WINBOND ]
