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I1620P 参数 Datasheet PDF下载

I1620P图片预览
型号: I1620P
PDF下载: 下载PDF文件 查看货源
内容描述: [Speech Synthesizer With RCDG, 40s, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16]
分类和应用: 光电二极管商用集成电路
文件页数/大小: 22 页 / 330 K
品牌: WINBOND [ WINBOND ]
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ISD1600 SERIES  
4. TABLE OF CONTENTS  
1. GENERAL DESCRIPTION.................................................................................................................. 2  
2. FEATURES ......................................................................................................................................... 2  
3. BLOCK DIAGRAM .............................................................................................................................. 3  
4. TABLE OF CONTENTS ...................................................................................................................... 4  
5. PIN CONFIGURATION ....................................................................................................................... 5  
6. PIN DESCRIPTION............................................................................................................................. 6  
7. FUNCTIONAL DESCRIPTION............................................................................................................ 8  
7.1. Detailed Description.................................................................................................................. 8  
8. TIMING DIAGRAMS.......................................................................................................................... 10  
9. ABSOLUTE MAXIMUM RATINGS [1] ................................................................................................ 12  
9.1 Operating Conditions............................................................................................................... 13  
10. ELECTRICAL CHARACTERISTICS............................................................................................... 14  
10.1. DC Parameters...................................................................................................................... 14  
10.2. AC Parameters...................................................................................................................... 15  
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 16  
12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 17  
12.1. 16-Lead 150mil Small Outline IC (SOIC) Package.......................................................... 17  
12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP)....................................................... 18  
12.3. Die Physical Layout.............................................................................................................. 19  
13. ORDERING INFORMATION........................................................................................................... 20  
14. VERSION HISTORY ....................................................................................................................... 21  
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