ISD1200 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................ 12
8. TIMING DIAGRAMS.......................................................................................................................... 13
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 14
9.1 Operating Conditions ................................................................................................................... 15
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 16
10.1. Parameters For Packaged Parts .............................................................................................. 16
10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 19
10.2. Parameters For DIE.................................................................................................................. 20
10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 23
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 24
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 27
12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC)...................................................................... 27
12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 28
12.3. Die Physical Layout
[1]
................................................................................................................ 29
13. ORDERING INFORMATION........................................................................................................... 31
14. VERSION HISTORY ....................................................................................................................... 32
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