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15104EI 参数 Datasheet PDF下载

15104EI图片预览
型号: 15104EI
PDF下载: 下载PDF文件 查看货源
内容描述: 单芯片1 16分钟期限语音记录/播放数码存储功能的设备 [SINGLE-CHIP 1 TO 16 MINUTES DURATION VOICE RECORD/PLAYBACK DEVICES WITH DIGITAL STORAGE CAPABILITY]
分类和应用: 存储
文件页数/大小: 88 页 / 604 K
品牌: WINBOND [ WINBOND ]
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ISD5100 – SERIES  
2. FEATURES  
Fully-Integrated Solution  
Single-chip voice record/playback solution  
Dual storage of digital and analog data  
Durations  
8 to 16-minute (ISD5116)  
4 to 8-minute (ISD5108)  
2 to 4-minute (ISD5104)  
1 to 2-minute (ISD5102)  
Low Power Consumption  
+2.7 to +3.3V (VCC) Supply Voltage  
Supports 2.0V and 3.0V interface logic  
Operating Current:  
ICC Play = 15 mA (typical)  
ICC Rec = 30 mA (typical)  
ICC Feedthrough = 12 mA (typical)  
Standby Current:  
ISB = 1µA (typical)  
Most stages can be individually powered down to minimize power consumption  
Enhanced Voice Features  
One or two-way conversation record  
One or two-way message playback  
Voice memo record and playback  
Private call screening  
In-terminal answering machine  
Personalized outgoing message  
Private call announce while on call  
Digital Memory Features  
Up to 4 Mb available (ISD5116)  
Up to 2 Mb available (ISD5108)  
Up to 1 Mb available (ISD5104)  
Up to 512Kb available (ISD5102)  
Storage of phone numbers, system configuration parameters and message address table in cellular  
application  
Easy-to-use and Control  
No compression algorithm development required  
User-controllable sampling rates  
Programmable analog interface  
Standard & Fast mode I2C serial interface (100kHz – 400 kHz)  
Fully addressable for multiple messages  
High Quality Solution  
High quality voice and music reproduction  
Winbond’s standard 100-year message retention (typical)  
100K record cycles (typical) for analog data  
10K record cycles (typical) for digital data  
Options  
Available in die form, TSOP and SOIC and PDIP (ISD5116 Only)  
Temperature: Commercial – Packaged (0 to +70°C) & die (0 to +50°C); Industrial (-40 to +85°C)  
Publication Release Date: October, 2003  
Revision 0.2  
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