Output Specifications
Voltage set accuracy
Regulation
± 1 %
– Input variation Vin min. to Vin max 0.5% max.
– Load variation 10 – 100 %
dual output models unbalanced: 2.0 % max.
dual output models unbalanced: 5.0 % max.
100 mVpk-pk max.
Ripple and noise
(20 MHz Bandwidth)
Temperature coefficient
Output current limitation
Short circuit protection
Start-up time
(with external output capacitor, see Note 1)
± 0.02 % /K
>105% of Iout max., foldback
indefinite (automatic recovery)
30ms max.
Max. capacitive load
General Specifications
Temperature ranges
1200μF
– Operating
– Derating
– Case temperature
– Storage
–25 °C ... +71°C
2.5%/K above 50°C
+100 °C max.
–40 °C ... +110 °C
85 % rel H max.
Humidity (non condensing)
Reliability, calculated MTBF (MIL-HDBK-217F ground be> 190’000h @ +25°C
Isolation voltage (60sec
Isolation capacity
– Input/Output
– Input/Output
1’500 VDC
235 pF typ.
Isolation resistance
Switching frequency (fixed)
Remote On/Off
– Input/Output (500 VDC)>100 M Ohm
330 kHz typ. (Pulse width modulation PWM)
– On:
– Off:
open circuit on pin RC
short circuit between pin RC and pin –Vin
Physical Specifications
Case material
Baseplate
Potting material
Weight
plastic PBT (UL94V-0 rated)
non conductive FR4
silicon (UL94V-0 rated)
12 g (0.41 oz)
Soldering temperature
max. 265 °C / 10sec.
Note 1
Recommended circuit to reduce conducted noise and output ripple & noise:
C1: 33μF low ESR electrolytic capacitor
For dual output models use capacitors for each output C2: 10μF low ESR electrolytic capacitor
C3: 1μ film capacitor