D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
METHOD
REQUIREMENTS
PERMISSIBLE CHANGE (R)
TEST
PROCEDURE
STABILITY
CLASS 1
OR BETTER
Stability for product types:
D/CRCW e3
4.18.2
58 (Td)
Resistance to
soldering heat
Flamability,
needle flame test
Damp heat,
steady state
Endurance at
upper category
temperature
Electrostatic
discharge
(human body model)
Component solvent
resistance
Solvent resistance
of marking
Solder bath method
(260 ± 5)
C;
(10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
155 °C, 1000 h
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
ESD voltage acc. to size
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1,
toothbrush
f = 10 Hz to 2000 Hz;
x, y, z
1.5 mm;
A
200 m/s
2
;
10 sweeps per axis
U
=
4.37
-
Periodic electric
overload
Single pulse high
voltage overload,
10 µs/700 µs
15 x
P
70
x
R
2 x
U
max.
;
0.1 s on; 2.5 s off;
1000 cycles
1
to 10 M
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
SIZE 0402 to 2512
STABILITY
CLASS 2
OR BETTER
EN
60115-1
CLAUSE
4.35
-
No burning after 30 s
± (1 %
R
+ 0.05
)
4.24
78 (Cab)
4.25.3
-
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.40
-
± (1 %
R
+ 0.05
)
4.29
45 (XA)
No visible damage
Marking legible,
no visible damage
4.30
45 (XA)
4.22
6 (Fc)
Vibration, endurance
by sweeping
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
4.27
-
Û
= 10 x
P
70
x
R
2 x
U
max.
;
10 pulses
± (1 %
R
+ 0.05
)
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
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Document Number: 20035
For technical questions, contact:
thickfilmchip@vishay.com
Revision: 04-Jun-12
131
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