BCM3814V60E15A3T02 参数 Datasheet PDF下载

BCM3814x60E15A3yzz

Absolute Maximum Ratings

The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.

Parameter

+HI to –HI

HI_DC or LO_DC Slew Rate

+LO to –LO

EXT BIAS to SGND

SCL to SGND

SDA to SGND

ADDR to SGND

Basic insulation (high voltage side to case)

Isolation Voltage /

Dielectric Withstand

[c]

Comments

Min

–1

Max

80

1

Unit

V

V/µs

V

V

A

V

V

V

V

DC

V

DC

V

DC

–1

–0.3

20

10

0.15

–0.3

–0.3

–0.3

1500

1500

N/A

5.5

5.5

3.6

Basic insulation (high voltage side to low voltage side)

[c]

Functional insulation (low voltage side to case)

The absolute maximum rating listed above for the dielectric withstand (high voltage side to the low voltage side) refers to the VIA package. The internal

safety approved isolating component (ChiP) provides basic insulation (2250V) from the high voltage side to the low voltage side. However, the VIA package

itself can only be tested at a basic insulation value (1500V).

BCM

®

in a VIA Package

Page 5 of 41

Rev 2.0

02/2018