BCM3814x60E15A3yzz
160
140
LO Side Current (A)
120
100
80
60
40
20
0
-60
-40
-20
0
20
40
36 – 60V
60
80
100
120
Case Temperature (°C)
Figure 1
— Specified thermal operating area
1. The BCM in a VIA package is cooled through the bottom case (bottom housing).
2. The thermal rating is based on typical measured device efficiency.
3. The case temperature in the graph is the measured temperature of the bottom housing, such that the internal operating temperature
does not exceed 125°C.
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
0
200
180
LO Side Current (A)
36
38
40
42
44
46
48
50
52
54
56
58
60
LO Side Power (W)
160
140
120
100
80
60
40
20
0
36
38
40
42
44
46
48
50
52
54
56
58
60
HI Side Voltage (V)
P
LO_OUT_DC
P
LO_OUT_PULSE
HI Side Voltage (V)
I
LO_OUT_DC
I
LO_OUT_PULSE
Figure 2
— Specified electrical operating area using rated R
LO_HOT
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80
100
LO Side Capacitance
(% Rated C
LO_EXT_MAX
)
LO Side Current (% I
LO_DC
)
Figure 3
— Specified HI side start up into load current and external capacitance
BCM
®
in a VIA Package
Page 9 of 41
Rev 2.0
02/2018