BCM352x110y300B00
General Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C ≤ TCASE ≤ 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Mechanical
Min
Typ
Max
Unit
Length
Width
L
W
H
32.25 / [1.270] 32.50 / [1.280] 32.75 / [1.289] mm / [in]
21.75 / [0.856] 22.00 / [0.866] 22.25 / [0.876] mm / [in]
6.48 / [0.255] 6.73 / [0.265] 6.98 / [0.275] mm / [in]
Height
Volume
Weight
Vol
W
No heat sink
4.81 / [0.294]
14.5 / [0.512]
cm3/ [in3]
g / [oz]
Nickel
0.51
0.02
2.03
0.15
Lead Finish
Palladium
Gold
µm
0.003
0.051
Thermal
BCM352F110T300B00 (T-Grade)
BCM352F110M300B00 (M-Grade)
-40
-55
125
125
Operating temperature
TJ
°C
Isothermal heatsink and
isothermal internal PCB
Thermal resistance
Thermal capacity
fJC
1
9
°C/W
Ws/°C
Assembly
6
lbs
lbs/ in2
°C
Peak compressive force
applied to case (Z-axis)
Supported by J-lead only
5.41
125
125
BCM352F110T300B00 (T-Grade)
BCM352F110M300B00 (M-Grade)
-40
-55
Storage
Temperature
TST
°C
Human Body Model,
“JEDEC JESD 22-A114C.01”Class 1C
ESDHBM
ESDCDM
2000
500
ESD Withstand
V
Charge Device Model,
“JEDEC JESD 22-C101-D”
Soldering
Peak temperature during reflow
Peak time above 217°C
MSL 4 (Datecode 1528 and later)
245
90
3
°C
s
60
1.5
1.5
Peak heating rate during reflow
Peak cooling rate post reflow
°C/s
°C/s
6
Safety
Working voltage (IN – OUT)
Isolation voltage (hipot)
Isolation capacitance
Isolation resistance
VIN_OUT
VHIPOT
CIN_OUT
RIN_OUT
500
800
VDC
VDC
pF
4242
500
10
Unpowered unit
At 500VDC
660
MΩ
MIL-HDBK-217Plus Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer Profile
3.15
6.64
MHrs
MHrs
MTBF
Telcordia Issue 2 - Method I Case III;
25°C Ground Benign, Controlled
cTUVus
cURus
Agency approvals / standards
CE Marked for Low Voltage Directive and ROHS recast directive, as applicable.
BCM® Bus Converter
Page 12 of 21
Rev 1.2
08/2016
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