BCM352x125y300A00
General Characteristics
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
Attribute
Symbol
Conditions / Notes
Mechanical
Min
Typ
Max
Unit
Length
Width
L
W
H
32.4 / [1.27]
21.7 / [0.85]
32.5 / [1.28]
22.0 / [0.87]
32.6 / [1.29]
22.3 / [0.89]
mm / [in]
mm / [in]
Height
Volume
Footprint
6.48 / [0.255] 6.73 / [0.265] 6.98 / [0.275] mm / [in]
Vol
F
No heat sink
4.81 / [0.295]
7.3 / [1.1]
1017
cm3/ [in3]
cm3/ [in3]
W/in3
No heat sink
Power density
Weight
PD
W
No heat sink
62
W/cm3
14 / [0.5]
g / [oz]
Nickel
0.51
0.02
2.03
0.15
0.05
Lead Finish
Palladium
Gold
µm
0.003
Thermal
Operating temperature
Storage temperature
TJ
-40
-40
125
125
1.5
°C
°C
TST
øJC
Thermal impedance
Thermal capacity
Junction to case
No J-lead support
1.1
9
°C/W
Ws/°C
Assembly
Peak compressive force
applied to case (Z-axis)
5
6
lbs
Human Body Model,
JEDEC JESD 22-A114C.01
ESDHBM
ESDMM
1500
400
ESD Withstand
VDC
Machine Model,
JEDEC JESD 22-A115-A
Soldering
Peak temperature during reflow
Peak time above 217°C
MSL 4 (Datecode 1528 and later)
245
150
3
°C
s
Peak heating rate during reflow
Peak cooling rate post reflow
1.5
1.5
°C/s
°C/s
6
Safety
Working voltage (IN – OUT)
Isolation voltage (hipot)
Isolation capacitance
Isolation resistance
MTBF
VIN_OUT
VHIPOT
CIN_OUT
RIN_OUT
500
800
VDC
VDC
pF
4242
500
10
Unpowered unit
660
MΩ
MHrs
MIL HDBK 217F, 25°C, GB
4.2
cTUVus
cURus
Agency approvals / standards
CE Marked for Low Voltage Directive and ROHS recast directive, as applicable.
BCM® Bus Converter
Page 12 of 21
Rev 2.0
08/2016
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