SPECIFICATIONS (CONT.)
General Specifications
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
10
cTÜVus
CE Mark
RoHS
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Over temperature shutdown
Thermal capacity
Baseplate to ambient
Baseplate to ambient; 1000 LFM
Baseplate to sink; flat greased surface
Baseplate to sink; thermal pad
125
130
23.8
7.7
2.9
0.40
0.36
135
°C
Ws /°C
°C / W
°C / W
°C / W
°C / W
Junction temperature
1.91/ 48,6
1.09/ 27,7
0.37/ 9,5
in / mm
in / mm
in / mm
Baseplate model
Baseplate model
Baseplate model
1.10/31,3
oz /g
See Mechanical Drawings, Figure 18, 19
2,250
3,000
Vdc
pF
MΩ
Input to output
Input to output
Input to output
UL /CSA 60950-1, EN 60950-1
Low voltage directive
3.5
Mhrs
25°C, GB
Min
Typ
Max
Unit
Notes
Auxiliary Pins
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
2.4
4.8
2.4
5.0
2.5
2.5
2.5
70
20
2.6
2.9
5.2
Vdc
Vdc
Vdc
mA
ms
µs
See Figure 12, time from PC low to output low
Source only
Min
Typ
Max
Unit
Notes
Figure 12
— V
OUT
at full load vs. PC disable
Bus Converter Module
BC048A096T024FP
Figure 13
— PC signal during fault
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