PRELIMINARY
Configuration Options
Standard
(1)
(Figure 17)
876 W/in
3
2.4 °C/W
1.1 °C/W
6.8 °C/W
V•I Chip Voltage Transformation Module
CONFIGURATION
Effective power Density
Junction-board
Thermal Resistance
Junction-Case
Thermal Resistance
Junction-Ambient
Thermal Resistance 300LFM
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
Standard with 0.25"
heatsink
440 W/in
3
2.4 °C/W
N/A
5.0 °C/W
22.0
0.87
32.0
1.26
6.3
0.25
STANDARD MOUNT
Figure 17—Onboard
mounting – package F
Figure 18—Hole
location for push pin heatsink relative to VIC
Thermal
Symbol
Parameter
Over temperature shutdown
Thermal capacity
R
θJC
R
θJB
R
θJA
R
θJA
Notes:
(1) B352F110T24 surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) B352F110T24 with a 0.25"H
Heatsink
surface mounted on FR4 board, 300 LFM.
Junction-to-case thermal impedance
Junction-to-board thermal impedance
Junction-to-ambient
(1)
Junction-to-ambient
(2)
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 8 of 13
VICOR [ VICOR CORPORATION ]
