PRELIMINARY
V•I Chip Bus Converter Module
Configuration Options
Configuration
Inboard(1)
(Package K)
Onboard(1)
(Package F)
Inboard with 0.25"
Heatsink
Onboard with 0.25"
Heatsink
Effective power density
1750 W/in3
2.1 °C/W
1.1 °C/W
1090 W/in3
2.4 °C/W
1.1 °C/W
680 W/in3
2.1 °C/W
N/A
550 W/in3
2.4 °C/W
N/A
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
6.5 °C/W
6.8 °C/W
5.0 °C/W
5.0 °C/W
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
21.5
0.85
22.0
0.87
32.0
1.26
32.0
1.26
4.0
0.16
6.3
0.25
ONBOARD MOUNT
INBOARD MOUNT
(V•I Chip recessed into PCB)
mm
in
mm
in
Figure 19—Inboard mounting – package K
Figure 20— Onboard mounting – package F
Input reflected ripple
measurement point
F1
10 A
Fuse
+Out
+In
+
Enable/Disable Switch
-Out
R3
C1
47 µF
electrolytic
TM
RSV
PC
5 mΩ
BCM
R2
Load
2 kΩ
C3
9.4 µF
+Out
D1
SW1
K
-In
Ro
–
-Out
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
Figure 21—BCM test circuit
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K480T30
Rev. 1.5
Page 10 of 15
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