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B048G120T10 参数 Datasheet PDF下载

B048G120T10图片预览
型号: B048G120T10
PDF下载: 下载PDF文件 查看货源
内容描述: VI芯片 - BCM母线转换模块 [VI Chip - BCM Bus Converter Module]
分类和应用:
文件页数/大小: 16 页 / 726 K
品牌: VICOR [ VICOR CORPORATION ]
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Specifications, continued
THERMAL
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient
1
Junction-to-ambient
2
PRELIMINARY
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
1.5
2.5
7.2
5.5
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
R
θJC
R
θJB
R
θJA
R
θJA
Notes
1. B048K120T10 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. B048L120T10 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
Temperature Cycling
High Temperature Storage
Moisture Resistance
Temperature Humidity Bias Testing (THB)
Pressure Cooker Testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent Resistance/Marking Permanency
Mechanical Vibration
Mechanical Shock
Electro Static Discharge Testing – Human Body Model
Electro Static Discharge Testing – Machine Model
Highly Accelerated Life Testing (HALT)
Dynamic Cycling
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
Per Vicor Internal
Test Specification
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture Sensitivity Level 4
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load,
-20°C to 125°C
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA Daisy-Chain Thermal Cycling
Ball Shear
Bend Test
Standard
IPC-SM-785
IPC-9701
IPC-9701
IPC J-STD-029
IPC J-STD-029
Environment
TC3, -40 to 125°C at <10 °C/min,
10 min dwell time.
No failure through intermetallic.
Deflection through 4 mm.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T10
Rev. 1.2
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