V•I Chip – BCM
Bus Converter Module
TM
B048K120T20
1
• 48V to 12V V•I Chip Converter
• 200 Watt (300 Watt for 1 mS)
• High density – up to 800 W/in
3
• Small footprint – 200 W/in
2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I Chip BGA package
Actual size
©
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 17.0 A
K =
1
/
4
Rout = 25 mΩ max
Product Description
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a pre-regulated 48 Vdc primary bus
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
applications. The BCM may be used to
power non-isolated POL converters or as
an independent 12 V source. Due to the
fast response time and low noise of the
BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the
input of POL converters is reduced—or
eliminated—resulting in savings of board
area, materials and total system cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
SG to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
500
-0.5 to 15.0
1500
-40 to 125
17.0
25
Unit
Vdc
Vdc
Vdc
Vdc
Notes
For 100 ms
Peak output current
The BCM achieves a power density of
800 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power BGA package
is compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
P
L
E
R
R
θJC
R
θJB
R
θJA
R
θJA
Case temperature during reflow
Storage temperature
Output power
Peak output power
IN
IM
208
-40 to 150
200
300
Parameter
Junction-to-case
Junction-to-BGA
Junction-to-ambient
3
Junction-to-ambient
4
Y
R
A
mA
Vdc
Vdc
°C
A
See note 2
Continuous
A
For 1 ms
°C
°C
W
W
Continuous
For 1 ms
Typ
1.1
2.1
Max
1.5
2.5
Units
°C/W
°C/W
°C/W
°C/W
Input to Output
Thermal Resistance
Symbol
6.5
5.0
7.2
5.5
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 8 oz Cu total, 300 LFM.
4. B048L120T20 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 1.7
Page 1 of 16
VICOR [ VICOR CORPORATION ]
