PRELIMINARY
V•I Chip Bus Converter Module
BCM
V•I Chip – BCM
Bus Converter Module
TM
B048K030T21
K indicates BGA configuration. For other
mounting options see Part Numbering below.
• 48 V to 3 V V•I Chip Converter
• 210 Watt (315 Watt for 1 ms)
• High density – 284 A/in
3
• Small footprint – 60 A/in
2
• Low weight – 0.5 oz (14 g)
• ZVS/ZCS isolated sine
amplitude converter
• 94% efficiency
• 125°C operation
• <1 µs transient response
• 3.5 million hours MTBF
• No output filtering required
• Surface mount BGA or J-Lead
packages
©
Vin = 38 - 55 V
Vout = 2.38 - 3.43 V
Iout = 70 A
K = 1/16
Rout = 2.0 mΩ max
Actual size
Product Description
The V•I Chip Bus Converter Module (BCM) is a high
efficiency (>94%), narrow input range Sine Amplitude
Converter (SAC) operating from a 38 to 55 Vdc primary
bus to deliver an isolated 2.38 V to 3.43 V secondary.
The BCM may be used to power non-isolated POL
converters or as an independent 2.38 – 3.43 V source.
Due to the fast response time and low noise of the
BCM, the need for limited life aluminum electrolytic or
tantalum capacitors at the input of POL converters is
reduced—or eliminated—resulting in savings of board
area, materials and total system cost.
The BCM achieves a current density of 284 A/in
3
and
may be surface mounted with a profile as low as 0.16"
(4 mm) over the PCB. Its V•I Chip power package is
compatible with onboard or inboard surface mounting.
The V•I Chip package provides flexible thermal
management through its low Junction-to-Case and
Junction-to-BGA thermal resistance. Owing to its high
conversion efficiency and safe operating temperature
range, the BCM does not require a discrete heat sink in
typical applications. It is also available with heat sink
options, assuring low junction temperatures and long
life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature
(1)
Storage temperature
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Values
-1.0 to 60
100
-0.3 to 7.0
-0.5 to 6.0
2,250
70
105
210
315
208
-40 to 125
-55 to 125
-40 to 150
-65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
T - Grade
M - Grade
Part Numbering
B
Bus Converter
Module
048
Input Voltage
Designator
K
030
Output Voltage
Designator
(=V
OUT
x10)
T
21
Output Power
Designator
(=P
OUT
/10)
Configuration Options
F = Onboard (Figure 20)
K = Inboard (Figure 19)
Product Grade Temperatures (°C)
Grade
Storage Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K030T21
Rev. 1.0
Page 1 of 15
VICOR [ VICOR CORPORATION ]
