AIM1714xB6MC7D5yzz
Thermal Considerations
The AIM in a VIA package can be cooled using single-side cooling
from the non-pin side. Since the AIM has a maximum internal
temperature rating, it is necessary to estimate this internal
temperature based on a system-level thermal solution. To this
purpose, it is helpful to simplify the thermal solution into a roughly
equivalent circuit where power dissipation is modeled as a current
source, isothermal surface temperatures are represented as voltages
sources, and thermal resistances are represented as resistors. Figure
4 shows the non-pin-side cooling “thermal circuit” for the AIM
in VIA package:
Maximum internal temperature
θINT_NON_PIN_SIDE
TC_NON_
+
PIN_SIDE
s
PDISS
s
Figure 4 — Single-side cooling thermal model
The internal power dissipation is PDISS, θINT_NON_PIN_SIDE is the
thermal resistance characteristic of the VIA package and the
non-pin-side surface temperature is represented as
TC_NON_PIN_SIDE. The AIM is best attached to a material with high
thermal conductivity (e.g., aluminum or copper) to maintain
temperature uniformity across the non-pin side.
AIM™ in a VIA™ Package
Page 10 of 14
Rev 1.3
09/2018
VICOR [ VICOR CORPORATION ]
