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Thermal Considerations
The AIM in a VIA package can be cooled using single side cooling
from the bottom side (i.e., facing opposite the screws of PCB pins).
Since the AIM has a maximum internal temperature rating, it is
necessary to estimate this internal temperature based on a system-
level thermal solution. To this purpose, it is helpful to simplify the
thermal solution into a roughly equivalent circuit where power
dissipation is modeled as a current source, isothermal surface
temperatures are represented as voltages sources, and thermal
resistances are represented as resistors. Figure 4 shows the bottom
side cooling “thermal circuit” for the AIM in VIA package:
Maximum internal temperature
RJC
+ TC_BOT
s
PDISS
s
Figure 4 — Bottom-side cooling VIA thermal model
The internal power dissipation is PDISS, RJC_BOT is the thermal
resistance characteristic of the VIA package and the bottom surface
temperature is represented as TC_BOT. The AIM is best attached to a
material with high thermal conductivity (e.g. aluminum or copper)
to maintain temperature uniformity across the bottom side.
AIM™ in a VIA Package
Page 10 of 14
Rev 1.2
08/2017
VICOR [ VICOR CORPORATION ]
