16. Through-Hole Socket-Mount System (InMate)
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
InMates are an innovative solution for through-hole socket
requirements. Consisting of individual plastic carriers for the input
and the output, each contains an array of sockets for either a full-,
half- or quarter-brick sized module. The sockets are factory loaded
into the carrier, which holds them rigidly in place throughout the
assembly and soldering process. The carriers are later removed,
leaving the sockets accurately positioned.
Designed for use with pin-compatible Maxi, Mini and Micro Family
converters, InMates are available for a wide range of PCB sizes and
mounting styles. PCB thicknesses can range from 0.055in [1,39mm]
to 0.1375in [3,49mm].
Sockets also allow for mounting modules either inboard, with a
cutout in the PCB for the module, to minimize the height above the
board or onboard. InMates are compatible with the ModuMate or
RoHS pin style.
InMates are available in standard recyclable JEDEC style trays for
use with automated pick-and-place equipment and are compatible
with most standard wave or hand solder operations. The sockets
are soldered into the board as part of the PCB assembly process.
The module can then be plugged into place at anytime later.
NOTE: Please refer to
Section 13
of the design guide for the InMate
soldering procedure.
Insert
Solder
Remove Carrier
Insert Module
Figure 16.1 —
InMate carrier / socket assembly and soldering process
Maxi, Mini, Micro Design Guide
Page 77 of 87
Rev 5.0
03/2018
VICOR [ VICOR CORPORATION ]
