4
PCB Layout Drawing
for Mini Size Module
PIN LEGEND
0.254
0.131
0.027
0.050
TYP
0.027
0.102
0.328
0.467
0.313
38°
SEE DETAIL A
PCB
0.027
0.027
Ø 0.032
±
0.003
16 VIA HOLES
0.065
0.027
0.069
Ø 0.032
±
0.003
3 VIA HOLES
0.063
1,59
0.536
13,61
SURFMATE INPUT
CONNECTOR
0.250
6,36
0.56
MAX
0.265
0.050
TYP
0.138
0.266
0.340
2.096
53,24
0.230
0.115
7 x Ø 0.233
FREE OF SOLDER MASK
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
Mini
Pin
Number
1
2
3
4
5
6
7
8
9
Symbol
+
PC
PR
–
–
–S
SC
+S
+
Function
FARM
Symbol
Function
Neutral
EMI
Line
– Out
Enable
Strap
BUS OK
+ OUT
Pin Dia.
(Inches / mm)
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
Ø 0.016 NON PLATED THRU
7 PL
+IN
N
Prim. Control EMI GRD
Parallel
NC
–IN
L
–OUT
–
– Sense
EN
Sec. Control
ST
+Sense
BOK
+Out
+
w
w
w
.
v
i
c
r
.
c
o
0.604
55°
2.000
50,8
0.300
7,62
DETAIL A
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
1.900
48,26
Ø 0.032
±
0.003
29 VIA HOLES
0.027
0.226
0.034
0.065
0.152
0.202
0.350
0.340
0.277
0.050
TYP
0.266
SEE DETAIL B
0.069
7 x Ø 0.016
0.230
TYP
0.115
Ø 0.032
±
0.003
3 VIA HOLES
0.027
0.065
0.063
1,59
0.300
7,62
2 x 0.125
±
0.002
3,18
±
0,05
4
3
2
1
6 x ø0.064
±
0.003
1,63
±0,08
(#52 DRILL)
MODULE
0.440
11,18
4
3
2
1
0.265
6,73
2.430
61,72
9
1.600
40,64
5
6
7
8
9
PCB
MODULE
EXCHANGE
TOOL-
BOTH ENDS
(PARTIAL)
0.06
1,6
1.98
50,3
6 7 8
4 x ø 0.130
±
0.003
3,30
±
0,08
PLATED THRU HOLE
FOR STANDOFF MTG
0.536
13,61
0.097
2,47
0.251
6,36
5
0.80
20,3
0.400
10,16
0.700
17,78
1.000
25,4
0.491
12,47
0.250
6,35
MODULE
EXCHANGE
TOOL
0.38
9,5
15°
1.25
31,6
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
MODULE
BASEPLATE
PCB
m
0.027
0.050
TYP
0.034
0.159
0.318
3
1
2
0.80
±
0.03
20,3
±
0,8
0.15
3,8
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
2 x Ø 0.316
FREE OF SOLDER MASK
1.400
35,56
1.900
±
0.002
48,26
±
0,05
SURFMATE OUTPUT
CONNECTOR
DETAIL B
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
PCB MOUNTING SPECIFICATIONS
(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
0.006
REF
0,15
BOTTOM OF
CAP TO TOP
OF PCB
All dimensions are
Inch
or
Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
DETAIL C
PRODUCT APPLICATION SPECIFICATIONS
VICOR [ VICOR CORPORATION ]
