VCXO
Dual Output
C5430
Recommended Reflow Profile
tp
Critical Zone
Tp
T to Tp
L
Ramp up
TL
Ramp down
tL
Ts
Ts
ts
preheat
25
t 25°C to peak
SMD oscillators must be on the top
side of the PCB during the reflow
process.
Time
Profile Feature
Pb-Free Assembly/Sn-Pb Assembly
Average ramp-up rate (TL to Tp)
Preheat -Temperature Min Tsmin
3°C/second max.
)
150°c
200°c
60-180 seconds
-Temperature Min Tsmax
-Time (min to max) (ts)
)
Tsmax to TL - Ramp-up Rate
3°C/second max.
Time maintainted above - Temperature (TL)
- Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
max 260°C
Time within 5°C of actual Peak Temperature (tp)
Ramp-down Rate
20-40 seconds
6°C/second max.
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
v.2005-10-28 · page 4 of 5
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