C4400
OCXO
Recommended Reflow Profile
tp
Critical Zone
TL to Tp
Tp
Ramp up
TL
Ramp dow n
tL
Ts
Ts
ts
preheat
25
t 25°C to peak
Time
Pb-Free Assembly
/Sn-Pb Assembly
Pb-Free Assembly
/Sn-Pb Assembly
Profile Feature
Average ramp-up rate (TL to Tp)
Preheat -Temperature Min Tsmin
Profile Feature
3°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
)
)
150°c
200°c
60-180 seconds
Time maintainted above
- Temperature (TL)
- Time (tL)
-Temperature Min Tsmax
-Time (min to max) (ts)
217°C
60-150 seconds
Tsmax to TL - Ramp-up Rate
3°C/second max.
Time maintainted above - Temperature (TL)
- Time (tL)
217°C
60-150 seconds
Time within 5°C of actual
Peak Temperature (tp)
20-40 seconds
Peak Temperature (Tp)
max 260°C
Ramp-down Rate
6°C/second max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Vectron International · www.vectron.com
v.2006-11-10 · page 4 of 5
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