MIR-3307-TC11
RECOMMENDED SOLDERING CONDITION
1. Reflow Soldering.
5 sec. MAX soldering time
240 oC MAX
- 5 oC /sec. MAX
+ 5 oC /sec. MAX
90 - 120 sec
Preheating
160+10 oC
1.a The above temp. profile shall be at the surface of LED resin.
1.b Number of reflow process should be less than 2 times.If the second reflow process is
performed, intervals between the first and the second process should be as short as possible
to prevent moisture absorption from LED resin. Cooling process to normal temp. is required
between the first and the second reflow process.
o
1.c Temp. fluctuation to LED at pre-heat process should be minimized. ( less than 6 C )
2. Dip Soldering.
o
2.a. Preheat temp. for soldering : 120 - 150 C, 60 - 120 sec.
o
2.b. Soldering temp.: Temp. of soldering pot 300 C Max and soldering time less than 2 sec.
2.c. Number of dip soldering process must be less than 2 times and the process is performed in
sequrence. Cooling process to normal temp. will be required between the first and the second
soldering process.
Unity Opto Technology Co., Ltd.
11/06/2003
UOT [ UNITY OPTO TECHNOLOGY ]
