X-band High Power Amplifier
CHA7114
16 15 14 13 12
11
1
2
10
9
3 4
5 6 7
8
Chip Mechanical Data and Pin references
Chip width and length are given with a tolerance of +/- 35µm
Chip thickness = 70µm +/- 10µm
HF pads (1, 10) = 118µm x 196µm
DC pads (3, 4, 5, 6, 7, 12, 13, 14, 15, 16) = 96µm x 96µm
DC pads (8, 11) = 186µm x 96 µm
Pin number
2, 9
3, 7, 12, 16
1
Pin name
Description
Not Connected
Not Connected
Input RF port
G1, G2
IN
4, 6, 13, 15
Vg1R, Vg2R Vg: Negative supply voltage (through divided bridge
Network)
5, 8, 11, 14
10
Vd1, Vd2
OUT
Vd: Positive supply voltage
Output RF port
Ref. : DSCHA7114-0197 - 16 Jul 10
6/8
Specifications subject to change without notice
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
