71-76GHz Medium Power Amplifier
CHA3080-98F
Mechanical data
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Chip thickness: 70µm.
Chip size: 3960x1780 ±35µm
All dimensions are in micrometers
RF Pads = 108 x 106 (BCB opening)
DC Pads = 86 x 83 (BCB opening)
Ref. : DSCHA30803245 - 02 Sep 13
9/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34