12.5-17GHz Driver Amplifier
CHA2266
Chip Assembly and Mechanical Data
100 pF
Drain supply feed
VD 1
VD 2
IN
OUT
Note: Supply feed should be bypassed. 25µm diameter gold wire is recommended
2320 +/- 35µm
1280µm
680µm
380µm
1020
+/- 35µm
335µm
335µm
Bond pad positions
(Chip thickness : 100 µm. all dimensions are in micrometers)
Ref. : DSCHA22662242 - 30-Aug.-02
6/7
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09