5-30GHz Attenuator
ATT_PO12748QAG
Recommended footprint for 16L-QFN3x3
The RF ports are DC blocked on chip. The DC connections (V1,V2) do not include any
decoupling capacitor in package, therefore it is mandatory to provide a good external DC
decoupling on the PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0005.
Ref: DSATT-PO12748QAG5276 - 3 Oct 05
9/14
Specifications subject to change without notice
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