DC/DC Converters
TDR 3WI Series
3 Watt
Pysical Specifications
Casing material
non-conductive plastic (UL94V-0 rated)
4.5 g (0.16 oz)
Package weight
Soldering profile for DIP-package models
Lead-free reflow solder process for SMD-package models
max. 265°C / 10 sec. (wave soldering)
as per J-STD-020D.01 (to find at:
www.jedec.org - free registration required)
Moisture sensivity level (for SMD-package models)
level 2a as per J-STD-033B.01 (to find at:
www.jedec.org - free registration required)
Packaging
– Tube
10 pcs packing unit
200 pcs packing unit
– Tape & Reel (only SMD models, add suffix –TR)
Outline Dimensions
DIP-Models
Pin-Out
0.25 (0.01)
Pin
1
Single
–Vin (GND)
Remote On/Off
NC
Dual
–Vin (GND)
Remote On/Off
Common
–Vout
13.55(0.533)
8.7 (0.35)
3.8
(0.15)
2
12.8(0.50)
6
8
9
7
6
7
NC
8
+Vout
+Vout
9
–Vout
Common
+Vin (Vcc)
14
+Vin (Vcc)
NC = not to connect
2
1
14
SMD-Models
Recommended Solder Pad
Dimension:
18.1 (0.71)
0-4°
7.4 (0.29)
1.2
(0.05)
17.2(0.68)
8.7 (0.35)
12.8 (0.50)
8
9
7
6
2.0 (0.08)
2
1
14
Dimensions in [mm], () = Inch
Tolerances: 0.5 ( 0.02)
Pin pich tolerances: 0.25 ( 0.01)
Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com
Rev. February 22. 2013
www.tracopower.com
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