TS9001
PACKAGE OUTLINE DRAWING
5-Pin SC70 Package Outline Drawing
(N.B., Drawings are not to scale)
0.65 TYP.
2
0.15 - 0.30
5
1
4
3
1.80 - 2.40
2
1.30 TYP.
1.80 - 2.20
8º - 12º ALL
SIDE
1
0.800 – 0.925
0.40 – 0.55
LEAD FRAME THICKNESS
0.10 - 0.18
0.15
TYP.
1.00
MAX
GAUGE PLANE
1.15 - 1.35
0º - 8º
0.00 - 0.10
0.10 MAX
0.26 - 0.46
0.275 - 0.575
NOTES:
1
DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS.
2
3. DIE IS FACING UP FOR MOLDING. DIE IS FACING DOWN FOR TRIM/FORM.
4
ALL SPECIFICATION COMPLY TO JEDEC SPEC MO-203 AA
5. CONTROLLING DIMENSIONS IN MILIMITERS.
6. ALL SPECIFICATIONS REFER TO JEDEC MO-203 AA
7. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC
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TS9001DS r1p0
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