TS12001
PACKAGE OUTLINE DRAWING
10-Pin TDFN22 Package Outline Drawing
(N.B., Drawings are not to scale)
0.900±0.050
Exp.DAP
2.000±0.050
PIN #1
IDENTIFICATION
0.300±0.050
0.400 Bsc
Pin 1 DOT BY
MARKING
10L STSLP
(2x2mm)
1.400±0.050
Exp.DAP
2.000±0.050
0.200±0.050
TOP VIEW
BOTTOM VIEW
NOTE!
·
·
All dimensions in mm.
This part is compliant with JEDEC MO-229 spec
A
MAX.
NOM.
MIN.
0.600
0.550
0.500
0.152 Ref
0.000-0.050
A
SIDE VIEW
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assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
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applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
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respective owners.
Touchstone Semiconductor, Inc.
Page 8
630 Alder Drive, Milpitas, CA 95035
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TS12001DS r1p0
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
