XC2164
Series
■PAD
LAYOUT FOR CHIP FORM
■PAD
DIMENSIONS
PIN NUMBER
1
2
3
4
5
6
PIN
NAME
Q
0
V
SS
/ XT
XT
V
DD
/ INH
PAD DIMENSIONS
X
Y
514
- 264
222
- 264
- 450
- 264
- 450
264
514
27
47
264
unit [μm]
1.3×0.8mm
XC2164xx1xxT : 280±20μm
XC2164xx1xxF : 200±20μm
V
DD
Level
100×100μm
■
PRODUCT CLASSIFICATION
●Ordering
Information
XC2164
①②③④⑤⑥
DESIGNATOR
DESCRIPTION
SYMBOL
A
B
C
D
K
L
M
N
5
6
1
(Table 1)
(Table 2)
C
M
R
L
T
F
DESCRIPTION
: Chip Enable: f0/1
: Chip Enable: f0/2 (Fundamental only)
: Chip Enable: f0/4 (Fundamental only)
: Chip Enable: f0/8 (Fundamental only)
: Output Enable: f0/1
: Output Enable: f0/2 (Fundamental only)
: Output Enable: f0/4 (Fundamental only)
: Output Enable: f0/8 (Fundamental only)
: Not polyimide coating on the chip surface (SOT-26 only)
: Polyimide coating on the chip surface (Chip form only)
: CMOS (V
DD
/2) *TTL: Fundamental 4MHz to 30MHz
: 3rd Overtone, built-in type
: Fundamental, built-in type
: Chip form
: SOT-26
: Embossed tape, standard feed
: Embossed tape, reverse feed
: Chip tray (Wafer thickness : 280±20μm)
: Chip tray (Wafer thickness : 200±20μm)
①
Divider Ratio
&
/INH Pin Function
②
③
④
⑤
Chip Surface Treatment
Duty Level
Frequency Range & Rf,
Cg, Cd Values
Packages
⑥
Device Orientation
Table 1: 3rd Overtone, Built-In Type
SYMBOL
A
B
C
D
E
F
H
K
L
FREQUENCY RANGE
3.3V ±10%
5.0V ±10%
−
20MHz to 30MHz
20MHz to 30MHz
30MHz to 40MHz
30MHz to 40MHz
40MHz to 50MHz
40MHz to 50MHz
50MHz to 65MHz
50MHz to 65MHz
65MHz to 80MHz
65MHz to 80MHz
80MHz to 95MHz
80MHz to 95MHz
95MHz to 110MHz
95MHz to 110MHz
110MHz to 125MHz
110MHz to 125MHz
−
Rf
(kΩ)
9.0
6.5
5.0
3.5
2.8
2.5
2.2
2.0
2.3
Cg
(pF)
21.5
20.0
16.0
14.0
12.5
10.0
8.0
7.0
5.5
Cd
(pF)
21.5
20.0
16.0
14.0
12.5
10.0
8.0
7.0
5.5
Table 2: Fundamental, Built-In Type
SYMBOL
M, V
T
FREQUENCY RANGE
3.3V ±10%
5.0V ±10%
4MHz to 30MHz
4MHz to 30MHz
4MHz to 30MHz
4MHz to 30MHz
Rf
（kΩ）
3.5/7.0
3.5/7.0
Cg
（pF）
20.0
35.0
Cd
（pF）
20.0
35.0
(*)Rf = 3.5MΩ@V
DD
= 5.0V Operation
Rf = 7.0 MΩ@V
DD
=3.3V Operation
2/12
TOREX [ TOREX SEMICONDUCTOR ]
