XBP06V4E2HR-G
■PACKAGING
INFORMATION
●
USP-3 Power Dissipation
Power dissipation data for the USP-3 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces.
Package heat-sink is tied to the copper traces.
Material:
Thickness:
Through-hole:
Glass Epoxy (FR-4)
1.6 mm
4 x 0.8 Diameter
2
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 150℃)
Ambient Temperature (℃)
25
150
Power Dissipation Pd (mW)
1000
0
Thermal Resistance (℃/W)
125.00
Pd-Ta特性グラフ
Pd vs. Ta
Power Dissipation: Pd (mW)
許容損失Pd（mW）
1200
1000
800
600
400
200
0
25
50
75
100
Ambient Temperature: Ta (℃)
周囲温度Ta（℃）
125
150
3/4
TOREX [ TOREX SEMICONDUCTOR ]
