THV3056_Rev.2.00_E
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Input power supply voltage
Vcc
18
V
INV1/2/3, INV_VGH/INV_VGL, FB1/2/3, NON_VGL,
DTC1/2/3, DTC_VGH/DTC_VGL, SS1/2/3, SS_SW, PG2/3,
SYSUVLO, SCP, SEL1/2, VREG5IN, VGL_UVP
VL_in1
6.5
V
BST2-LL2, OUT_H2-LL2
VL_in2
VH_in1
VH_in2
VL_out
VH_out1
VH_out2
VH_cc
6.5
18
20
6.5
20
18
20
24
V
V
V
V
V
V
V
V
XTEST
VCIN, VCFB
OUT1, VREF, RT, OUT_L2, VREG5, PUP_PG, TCON_XRST
VCOUT, OUT_HLDO, OUT_VGL, OUT_VGH, VO_1SW
LL2, OUT3
V_VGL, V_VGH, V_OUT3, V_VC
BST2, OUT_H2
VH_out3
Output Current
OUT1, OUT_L2, OUT_H2, OUT3, OUT_VGH, OUT_VGL
Iomax
1
A
Output Current
OUT_HLDO
Iomax2
80
mA
Power dissipation
Pd
Tj
mW
°C
°C
°C
°C
4125 (Ta<25°C)
150
Junction temperature
Operating temperature
Storage temperature
Ta
-40 °C +85
Tstg
Tlead
-55 °C +150
255 / +5 / -0 / 10sec
Lead temperature for soldering
Power Dissipation
4500
4000
3500
3000
2500
2000
1500
1000
500
0
-40
-20
0
20
40
60
80
100
120
140
160
Ambient Temperature Ta(℃)
7/32
THine Electronics, Inc.
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THINE [ THINE ELECTRONICS, INC. ]
