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73S8024RN-32IM 参数 Datasheet PDF下载

73S8024RN-32IM图片预览
型号: 73S8024RN-32IM
PDF下载: 下载PDF文件 查看货源
内容描述: [暂无描述]
分类和应用: 模拟IC信号电路
文件页数/大小: 27 页 / 390 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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DS_8024RN_020  
73S8024RN Data Sheet  
Table of Contents  
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Pin Description ....................................................................................................................................5  
System Controller Interface................................................................................................................7  
Power Supply and Voltage Supervision............................................................................................8  
Card Power Supply..............................................................................................................................9  
Over-Temperature Monitor .................................................................................................................9  
On-Chip Oscillator and Card Clock ...................................................................................................9  
Activation Sequence .........................................................................................................................10  
Deactivation Sequence .....................................................................................................................12  
OFF and Fault Detection...................................................................................................................13  
10 I/O Circuitry and Timing....................................................................................................................13  
11 Typical Application Schematic.........................................................................................................15  
12 Electrical Specification .....................................................................................................................16  
12.1 Absolute Maximum Ratings.........................................................................................................16  
12.2 Recommended Operating Conditions .........................................................................................16  
12.3 Package Thermal Parameters.....................................................................................................16  
12.4 Smart Card Interface Requirements............................................................................................17  
12.5 Characteristics: Digital Signals....................................................................................................19  
12.6 DC Characteristics.......................................................................................................................20  
12.7 Voltage / Temperature Fault Detection Circuits ..........................................................................20  
13 Mechanical Drawing (20QFN)...........................................................................................................21  
14 Package Pin Designation (20QFN)...................................................................................................22  
15 Mechanical Drawing (32QFN)...........................................................................................................23  
16 Package Pin Designation (32QFN)...................................................................................................24  
17 Mechanical Drawing (SO) .................................................................................................................25  
18 Package Pin Designation (SO) .........................................................................................................25  
19 Ordering Information.........................................................................................................................26  
20 Related Documentation ....................................................................................................................26  
21 Contact Information ..........................................................................................................................26  
Revision History ........................................................................................................................................27  
Rev. 1.8  
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