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73K324BL 参数 Datasheet PDF下载

73K324BL图片预览
型号: 73K324BL
PDF下载: 下载PDF文件 查看货源
内容描述: 单芯片调制解调器瓦特/集成混合 [Single-Chip Modem w/ Integrated Hybrid]
分类和应用: 调制解调器
文件页数/大小: 34 页 / 205 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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73K324BL  
CCITT V.22bis,V.23,V.22,V.21, Bell 212A  
Single-Chip Modem w/ Integrated Hybrid  
DATA SHEET  
DTE USER  
NAME  
PIN  
TYPE  
DESCRIPTION  
EXCLK  
22  
I
EXTERNAL CLOCK: This signal is used in synchronous  
transmission when the external timing option has been  
selected. In the external timing mode the rising edge of  
EXCLK is used to strobe synchronous DPSK transmit data  
applied to on the TXD pin. Also used for serial control  
interface.  
RXCLK  
26  
O
RECEIVE CLOCK: The falling edge of this clock output is  
coincident with the transitions in the serial received data  
output. The rising edge of RXCLK can be used to latch the  
valid output data. RXCLK will be valid as long as a carrier is  
present.  
RXD  
25  
21  
O
O
RECEIVED DATA OUTPUT: Serial receive data is available  
on this pin. The data is always valid on the rising edge of  
RXCLK when in synchronous mode. RXD will output  
constant marks if no carrier is detected.  
TXCLK  
TRANSMIT CLOCK: This signal is used in synchronous  
transmission to latch serial input data on the TXD pin. Data  
must be provided so that valid data is available on the rising  
edge of the TXCLK. The transmit clock is derived from  
different sources depending upon the synchronization mode  
selection. In internal mode the clock is generated internally.  
In external mode TXCLK is phase locked to the EXCLK pin.  
In slave mode TXCLK is phase locked to the RXCLK pin.  
TXCLK is always active.  
TXD  
24  
I
TRANSMIT DATA INPUT: Serial data for transmission is  
applied on this pin. In synchronous modes, the data must be  
valid on the rising edge of the TXCLK clock. In asynchronous  
modes (1200/600 bps or 300/1200 baud) no clocking is  
necessary. DPSK data must be 1200/600 bps +1%, -2.5% or  
+2.3%, -2.5 % in extended over speed mode.  
.
Page: 7 of 34  
© 2005, 2008 TERIDIAN Semiconductor Corporation  
Rev 6.1