MICROPROCESSOR MONITOR
TC1232
*Stresses beyond those listed under "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin (With Respect to GND) – 0.3V to +5.8V
Operating Temperature Range:
TC1232C .......................................... 0°C to +70°C
TC1232E ..................................... – 40°C to + 85°C
Storage Temperature Range ................ – 65°C to +150°C
Lead Temperature (Soldering, 10 sec) ................. +300°C
DC ELECTRICAL CHARACTERISTICS: TA = TMIN to TMAX; VCC = +4.5V to 5.5V, unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VCC
VIH
Supply Voltage
ST and PB RST
Input High Level
4.5
2.0
5.0
—
5.5
V
V
VCC +0.3
Note 1
VIL
ST and PB RST
Input Low Level
– 0.3
—
+0.8
V
IL
Input Leakage ST, TOL
Output Current RST
– 1.0
– 1.0
2.0
—
–12
10
+1.0
—
µA
mA
mA
µA
V
IOH
VOH = 2.4V
VOL = 0.4V
Note 2
IOL
Current RST, RST
—
ICC
Operating Current
—
50
200
4.74
4.49
VCCTP
VCCTP
VCC 5% Trip Point (Note 3)
VCC 10% Trip Point (Note 3)
TOL = GND
TOL = VCC
4.50
4.25
4.62
4.37
V
CAPACITANCE (Note 4): TA = +25°C
Symbol
Parameters
Test Conditions
Min
Typ
Max
Units
CIN
Input Capacitance ST, TOL
Output Capacitance RST, RST
—
—
—
—
5
7
pF
pF
COUT
AC ELECTRICAL CHARACTERISTICS: TA = TMIN to TMAX; VCC = +5V to +10%, unless otherwise specified.
Symbol
Parameters
Test Conditions
Min
Typ
Max
Units
tPB
PB RST (Note 5)
PB RST Delay
Figure 3
Figure 3
20
1
—
4
—
20
msec
msec
msec
nsec
tPBD
tRST
tST
Reset Active Time
ST Pulse Width
ST Time-out Period
250
75
610
—
1000
—
Figure 4
tTD
Figure 4
TD Pin = 0V
TD Pin = Open
TD Pin = VCC
Figure 5
62.5
250
500
10
150
600
1200
—
250
1000
2000
—
msec
msec
msec
µsec
tF
VCC Fall Time (Note 4)
5-20
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