PRELIMINARY INFORMATION
100mA CMOS LDO WITH SHUTDOWN
AND REFERENCE BYPASS
TC1015
*Stresses beyond those listed under "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .................................................................7V
Output Voltage .................................. (– 0.3) to (VIN + 0.3)
Power Dissipation ....................Internally Limited (Note 7)
Operating Temperature .................... – 40°C < TJ < 125°C
Storage Temperature ............................– 65°C to +150°C
Maximum Voltage On Any Pin .......... VIN + 0.3V to – 0.3V
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25
°C, unless otherwise noted.
Boldface type specifications apply for junction temperatures of – 40°C to +125°C.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIN
Input Operating Voltage
Maximum Output Current
Output Voltage
—
100
—
—
6.5
V
mA
IOUT
—
MAX
VOUT
Note 1
Note 2
VR – 2.5%
V
R ±0.5% VR + 2.5%
V
TCVOUT
VOUT Temperature Coefficient
20
—
ppm/°C
40
∆VOUT/∆VIN
∆VOUT/VOUT
Line Regulation
Load Regulation
(VR + 1V) < VIN < 6V
—
—
0.01
0.5
—
—
%
%
IL = 1.0mA to IOUT
(Note 3)
MAX
VIN – VOUT
Dropout Voltage (Note 4)
IL = 0.1mA
IL = 20mA
IL = 50mA
IL =100mA
(Note 4)
—
20
70
93
—
mV
112
IGND
IIN
Ground Pin Current
IL = IOUT
—
—
—
—
—
—
—
—
50
0
—
µA
µA
MAX, (Note 5)
Supply Current
SHDN = VIH, IL = 0
SHDN = 0V
IINSD
PSRR
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
Output Noise
—
0.05
—
µA
FRE ≤ 1kHz
64
dB
IOUT
VOUT = 0V
Note 6
300
0.04
260
500
—
mA
SC
∆VOUT/∆PD
%/W
nV/√Hz
eN
IL = IOUT
—
MAX
470pF from Bypass to GND
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
VIN = 2.5V to 6.5V
VIN = 2.5V to 6.5V
45
—
—
—
—
%VIN
%VIN
15
NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.3V, 5.0V.
MIN) x 10 6
2. TCVOUT = (VOUT
VOUT
–
MAX
∆T
x
VOUT
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load
current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD).
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
.
2
TC1015-01-6/5/97
TELCOM [ TELCOM SEMICONDUCTOR, INC ]
