LOW POWER, BANDGAP
VOLTAGE REFERENCES
TC04A
TC04B
TC05A
TC05B
Lead Temperature (Soldering, 10 sec)
ABSOLUTE MAXIMUM RATINGS*
TO-92 Package .............................................. +300°C
Surface Mount Package ................................. +300°C
Power Dissipation ............................. Limited by Forward/
Reverse Current
Forward Current .................................................... +10mA
Reverse Current.................................................... +30mA
Storage Temperature Range ................ – 65°C to +150°C
Operating Temperature Range
*Functional operation above the absolute maximum stress ratings is not
implied.
TO-92 Package ..................................... 0°C to +70°C
Surface Mount Package ........................ 0°C to +70°C
ELECTRICAL CHARACTERISTICS: TA = +25°C, unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VBR
Reverse Breakdown Voltage:
IR = 100µA
TC04
TC05
1.24
2.45
1.26
2.50
1.28
2.60
V
DVBR
Reverse Breakdown Voltage Change:
TC04
15µA < IR < 20mA
20µA < IR < 1mA
20µA < IR < 20mA
25µA < IR < 1mA
IR = 100µA
—
—
—
—
10
0.25
10
20
1
mV
TC05
20
1
0.25
TC
IR
Temperature Coefficient:
TC04A/TC05A
TC04B/TC05B
—
—
0.003
0.003
0.005
0.01
%/°C
Reverse Current:
TC04
0.015
0.020
—
—
20
20
mA
TC05
3-6
TELCOM SEMICONDUCTOR, INC.
TELCOM [ TELCOM SEMICONDUCTOR, INC ]
