CERAMIC CHIP INDUCTORS
C3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Impedance
HP4291A, HP4287A+16092A
HP4338B
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Temperature Rise Test
30°C max. (ǻt)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Solder Heat Resistance
No mechanical damage
Remaining terminal electrode : 70% min.
Preheating Dipping Natural
cooling
260°C
150°C
60
10±0.5
seconds
seconds
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Solderability
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping Natural
cooling
245°C
150°C
60
4±1.0
seconds
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For C Series :
Size
1
Force (Kfg)
0.2
Time (sec)
> 25
2
3
4
0.5
0.6
1.0
W
5
1.0
6
1.0
7
1.5
W
8
2.0
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
20(.787)
Bending
45(1.772) 45(1.772)
100(3.937)
40(1.575)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
