CERAMIC CHIP INDUCTORS
C2 SERIES
9. SOLDERING :
9-1. Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max.
Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions
may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
A
B
Slope of temp. rise
Heat time
1 to 5
50 to 150
120 to 180
1 to 5
°C/sec
sec
main heating
230°C
E
Heat temperature
Slope of temp. rise
Time over 230°C
Peak temperature
°C
180°C
120°C
C
D
°C/sec
sec
pre-heating
90 ~ 120
255 ~ 260
normal
temperature
°C
E
A
B
C
D
Peak hold time
No. of mounting
10 max.
3
sec
times
TIME(sec.)
(Melting area of solder)
9-2. Soldering Iron
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 3.0mm tip diameter (max)
e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm
f) Limit soldering time to 3 secs.
Upper limit
9-3. Solder Volume :
Recommendable
Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical
performance. Solder shall be used not to be exceed as shown in right side.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
