CERAMIC CHIP INDUCTORS
C0 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 5
SUPERWORLD ELECTRONICS (S) PTE LTD
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
