CL325
8-Lead SOIC (w/Heat Slug) Package Outline (SG)
4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch
D1
θ1
D
8
8
Exposed
Thermal
Pad Zone
E1
E
E2
Note 1
(Index Area
D/2 x E1/2)
Gauge
Plane
L2
θ
Seating
Plane
L
1
1
L1
Top View
Bottom View
View B
A
View
B
h
h
Note 1
A A2
A1
Seating
Plane
e
b
A
Side View
View A-A
Note 1:
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a
mold, or an embedded metal or marked feature.
Symbol
A
A1
MIN 1.25 0.00 1.25 0.31 4.80 3.30* 5.80 3.80 2.29*
NOM 4.90 ±.00 3.90
MAX 1.70 0.15 1.70 0.51 5.00 3.81* ±.20 4.00 2.79*
A2
b
D
D1
E
E1
E2
e
h
L
L1
L2
θ
0O
-
θ1
5O
-
0.25 0.40
Dimension
(mm)
1.27
BSC
1.04 0.25
REF BSC
-
-
-
-
-
-
-
-
0.50 1.27
8O 15O
JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005.
Dimensions marked with (*) are non-JEDEC dimensions.
Drawings not to scale.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc.# DSFP-CL325
NR111207
7
SUPERTEX [ Supertex, Inc ]
