Characteristics
1N5806U
1
Table 2.
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
stg
T
j
T
sol
Characteristics
Absolute ratings (limiting values)
Parameter
Repetitive peak reverse voltage
Forward rms current
Average forward rectified current
Forward surge current
Storage temperature range
Maximum operating junction temperature
Maximum soldering temperature
(1)
T
c
= 135 °C,
δ
= 0.5
t
p
= 8.3 ms sinusoidal
t
p
= 10 ms sinusoidal
Value
150
6
2.5
35
A
33
-65 to + 175
175
245
°C
°C
°C
Unit
V
A
A
1. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed.
Table 3.
Symbol
R
th (j-c) (1)
Thermal resistance
Parameter
Junction to case
Value
13
Unit
°C/W
1. Package mounted on infinite heatsink
Table 4.
Symbol
Static electrical characteristics
Parameter
Tests conditions
T
j
= 25 °C
V
R
= 150 V
V
R
= 160 V
Min.
-
-
-
-
-
I
F
= 1 A
I
F
= 2.5 A
-
-
-
Typ.
-
-
-
-
-
-
-
-
Max.
0.5
20
10
10
880
800
1075
1000
mV
µA
Unit
I
R (1)
Reverse current
T
j
= 125 °C
T
j
= 25 °C
T
j
= -65 °C
T
j
= 25
°C
T
j
= 125
°C
T
j
= -65
°C
T
j
= 25
°C
V
F (2)
Forward voltage
1. Pulse test: tp = 5 ms,
δ
< 2%
2. Pulse test: tp = 680 µs,
δ
< 2%
To evaluate the conduction losses use the following equation:
P = 0.70 x I
F(AV)
+ 0.10 x I
F2(RMS )
2/7
Doc ID 15986 Rev 2
STMICROELECTRONICS [ STMICROELECTRONICS ]
